Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD


Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159


Flux cored solder wire

For Aluminum wire soldering K4-C601-3
Comply to aluminum wire

Solderable by iron to aluminum wire, used such as in the HDD of the actuator.

Solderable to aluminum

●Soldering test to aluminum

Solderable to aluminum
Put solder wire on aluminum board and heat by 270℃

Prevent galvanic corrosion

Additive elements achieve high soldering reliability and prevent the galvanic corrosion that occurs between the aluminum material and solder.

High soldering reliability

●Electrolytic corrosion test

Measure the time until the solder delamination occurs, stored in 40℃ of artificial seawater, after soldering the two aluminum plates

Good water washability

Apply water-soluble base material instead of rosin.The residue after soldering is possible to wash away easily with water.

Good water washability

●Ionic residue test

The flux residue is possible to clean with water

  • 【Test method】JIS Z 3197 8.5.2

    Cleaning solution:Pure water
    Washing temp:50℃
    Washing time:1min
    Number of washings:3 times

Alloy type K4 (Sn:Bal / Ag 3.5 / Ni 0.2)
Flux type Fluorine type
Flux contents (%) 3.0%
Halide contents 17%~23%
Copper plate corrosion test No corrosion
(after cleaning with water)
Insulation resistance(Ω) More than 1.0×108Ω
(after cleaning with water)
Electrochemical migration No migration
(after cleaning with water)
Fluorine contents(%) 20%
Flux name C601

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