Solder paste (bottle)
Low residue type 6001 series
Applicable for ICT testing
Reduce failure ratio of ICT test.Select special base material to reduce flux residue after soldering.
Very low failure ratio on ICT
●Residue penetrate force test
Penetrating force is lower than regular product
Reflow with N2(O2 ratio 1000ppm) and measure penetrating force of checker pin with 10mm/sec speed until get contact
Good wettability
Apply special activator and achieved to get good wettability although the flux residue is lesser than regular solder paste
Good wettability
●Continuous wettability test
【Conditions】
Reflow with N2
O2 ratio 1000ppm
0.5mm pitch QFP
Stencil thickness 0.15mm
Stable printing quality
Prevent reaction between flux and solder powder and stabilize printing quality during long time continuous printing of paste.
Good stability on continuous printing
●Shape of printed solder paste
Stable shape after long time printing
0.3mm QFP
Stencil thickness:0.12mm
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | MIL-RMA |
| Halide contents | 0.01%～0.05％ |
| Powder particle size（μm） | 45～25(Type 3) |
| Flux contents（％） | 10.5% |
| Deterioration（Pa・S） | 195 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 6001 |
