Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (syringe)

Halogen free low melting point 2300 series
Reduce solder ball

Special activator enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
0.4mm pitch QFP
Beam power:40W

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of 2300 series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Non compliant

Comply to major halogen-free standards

Applied with low melting point alloy

Special designed for SMT of heat-sensitive parts.Solution for weak-heat resistant parts soldering.

Various applications

●Examples

Suitable for various SMT parts

Alloy type F12 (Sn:Bal / Bi 57.0 / Ag 1.0)
Flux type Halogen free
Halide contents 0.16%~0.24%
Powder particle size(μm) 20~10(Equivalent to type 5)
Flux contents(%) 13.0%
Deterioration(Pa・S) 110
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 1.0×108Ω
Electrochemical migration No migration
Halogen contents(ppm) Cl : Less than 50
Br : Less than 100
Flux name 2300

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