Solder paste (syringe)
Halogen free low melting point 2300 series
Reduce solder ball
Special activator enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.
Reduce solder ball
●Comparison of solder ball
No solder ball by rapid heating
0.4mm pitch QFP
Beam power:40W
Halogen-free compliant
No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.
Halogen-free compliant
●Compliant situation of 2300 series
Standards | Compliant situation |
---|---|
JPCA-ES01 | Compliant |
IEC61249-2-21 | Compliant |
IPC4101B | Compliant |
JEITA ET-7304A | Non compliant |
Comply to major halogen-free standards
Applied with low melting point alloy
Special designed for SMT of heat-sensitive parts.Solution for weak-heat resistant parts soldering.
Various applications
●Examples
Suitable for various SMT parts
Alloy type | F12 (Sn:Bal / Bi 57.0 / Ag 1.0) |
---|---|
Flux type | Halogen free |
Halide contents | 0.16%~0.24% |
Powder particle size(μm) | 20~10(Equivalent to type 5) |
Flux contents(%) | 13.0% |
Deterioration(Pa・S) | 110 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | More than 1.0×108Ω |
Electrochemical migration | No migration |
Halogen contents(ppm) | Cl : Less than 50 Br : Less than 100 |
Flux name | 2300 |