Flux cored solder wire
Good wettability type MFJ series
Support low Ag alloy
Good wettability with low Ag alloy can help to reduce material cost.
Good wettability for both of 3% Ag and low Ag
●Wettability test for through hole pad
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Reduce flux spattering
Select flux base material according to higher melting point of solder alloy.Less spattering can achieve high performance soldering.
Less spattering
●Spattering test with soldering robot
Reduce flux spattering
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Collect spattered flux onto thermal paper.
【Condition】
Iron temp:380℃
Feed speed:15mm/s
Feed length:5mm×200 shots
Good durability of wettability
Good solderbility can achieve higher productivity for various type parts
Good durability of wettability
●Comparison of solder bridge with line soldering
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7) |
|---|---|
| Flux type | JIS-A MIL-RMA |
| Flux contents (%) | 3.0％、4.0％、6.0％ |
| Halide contents | 0.08％～0.14％ |
| Copper plate corrosion test | No Corrosion |
| Copper mirror corrosion | No Corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No Migration |
| Flux name | MFJ |
