Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Flux cored solder wire

Good wettability type MFJ series
Support low Ag alloy

Good wettability with low Ag alloy can help to reduce material cost.

Good wettability for both of 3% Ag and low Ag

●Wettability test for through hole pad

Reduce flux spattering

Select flux base material according to higher melting point of solder alloy.Less spattering can achieve high performance soldering.

Less spattering

●Spattering test with soldering robot

Reduce flux spattering

  • Collect spattered flux onto thermal paper.

    【Condition】
    Iron temp:380℃
    Feed speed:15mm/s
    Feed length:5mm×200 shots

Good durability of wettability

Good solderbility can achieve higher productivity for various type parts

Good durability of wettability

●Comparison of solder bridge with line soldering

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
R8 (Sn:Bal / Cu 0.7)
Flux type JIS-A
MIL-RMA
Flux contents (%) 3.0%、4.0%、6.0%
Halide contents 0.08%~0.14%
Copper plate corrosion test No Corrosion
Copper mirror corrosion No Corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No Migration
Flux name MFJ

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