鉛フリーはんだ製造・販売メーカーは大阪の石川金属株式会社

石川金属株式会社

TÜV RHEINLAND認定

Management System
ISO 9001:2008
ISO 14001:2004

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

Wetting(Solder Paste)

Strategy of Reflow Profile

In the case of lead-free solder, we take a method called “trapezoidal profile” including a long pre-heating and main-heating. The melting point of the solder is about 220℃, while the heat-resistant temperature of the component is about 250℃. “Long preheating zone” eliminates the temperature difference due to the size of the parts prevents the lack of wetting by too big heat conduction of large parts, and the damage by overheating of small parts.

Reflow Profile
リフロープロファイル
  • ①Raising Temp Zone 1
  • ②Preheating Zone
  • ③Raising Temp Zone 2
  • ④Main heating Zone
  • ⑤Cooling Zone

Deterioration of the solder paste in preheating

In general, preheating temperature is 150-180℃, time is 90-120 seconds. In preheating, flux of solder paste start the reaction by heat, lost it activity gradually and decrease the wettability. Therefore, to the extent that the temperature of the component during the heating is increased to about 240 ℃, temperatures as low as possible, pre-heating should be carry out in a short time as possible ideally.


Wettablity Improvement by solder materials

Flux of the solder paste is added the most suitable active agent for pre-heating temperature, main-heating temperature, respectively. Your informing to the solder manufacturer about mounted article parts, shapes, dimensions exactly gives you good information about more suitable solder paste and the recommended reflow profile. Please contact us so we offer a solder paste which is suitable for wide range of preheating temperature and have good wettability for various parts


Void(Solder Paste)
What is “Void”?

“Void” is the phenomenon which the gas generated during soldering remains internal to the soldering part. In the industrial standard "IPC-A-610", Voids is allowed up to 25% by area of the junction, but the components such as power devices, has been required to reduce the voids in order to secure the heat radiation efficiency.

ボイドの問題
Void that occurred QFP lead

Cause of “Void”
The cause of the void will include the following three points.
  1. ①Bubbles remaining in the non-wetting part
  2. ②Decomposition gas from flux remaining in the solder
  3. ③Decomposition gas from flux caught in the non-wetting part
ボイドの原因
Cause of the void (ex. QFP)

Prevention of “Void”

To prevent voids, It is essential that you do not make the non-wetting areas in the substrate and the component . It is important to fully manage not to deteriorate such as oxidation, moisture absorption in each of the storage. Please contact us so we offer a void prevention type of solder paste, which also has well wettabillity and uses less-gas-generation materials.


non-wetting, bridge, icicle
non-wetting, bridge, icicle

Non-wetting, bridge, icicle are the problems due to the activity of the flux. Flux activity decreases over time by heating in soldering. Reviewing the selection of procedures and flux, enables to reduce these problems.

ぬれ不良、ブリッジ、つの

Influence to Flux in soldering

Active agents in flux influence directly on wettability and activity of solder. Active agents are exhausted to decompose and volatilize by heat during soldering. It is important to suppress volatilization of active agents and supply fresh one to the soldering portion in preventing the non-wetting.

はんだ付け時にフラックス中で起こる変化

Reviewing the procedures of soldering

Supply timing of solder is very important, regardless of the hand soldering or solder robot. Not supplying a large amount of solder at a time to the soldering portion, and supplying small quantities at a time, keeps always fresh active agents in the soldering portion and achieve a good wetting. Especially in a case of solder robot, finish can vary greatly.  In addition, it is also effective to review the problem such as the too high temp. of the iron, small heater capacity and no match the dimensions of the parts and the tip.

Good soldering
はんだ付け時け作業の見直し

Selection of solder materials

Active agent in the flux has been selected according to the application of each product, which react with optimal temperature. And in consultation with the manufacturer, it is important to use a solder adapted to the implementation goods and the method.   Please contact us so we offer a flux cored solder wire, which also has well wettability for various implementation goods and in broad temperature range.


Flux Spattering, Solder ball
Flux Spattering

Flux spattering is frequent issues in soldering with FCSW (flux cored solder wire). Not only bad appearance of the product but also failure of the product are caused by the flux stick to LCD screen, camera unit, switch contacts.

フラックス飛散
Flux Spattering

Cause of Flux Spattering

Flux Spattering causes by occurring solder melting and a explosion at the same time which the low boiling point or decomposition of active agent in flux boiling and gasified by heat in soldering.

フラックス飛散

Solder ball

Solder ball often occurs at the same time with flux spattering, because of supplying solder too fast, or move tips so hard and too much solder.

はんだを急激に送る、これを激しく動かす、はんだ量が多すぎる
はんだボール
Solder ball

Selection of solder materials

Using high viscosity of the flux and using less material gasification make it possible to reduce the flux spattering by the solder material. Please contact us so we offer a low spattering type of flux cored solder wire


Visual inspection, discoloration on the LED board
Color tone of flux

Rosin used in the flux has a different color tone depending on the model. There are a variety of things from colorless transparent to those of brown. In addition, some of the active agent and additives are colored by heat in soldering.


LED lighting board

In LED lighting, the board has been applied with white resist, and brown flux residue may spoil the appearance of the product.


Influence on visual inspection

When the board is displayed by silk, brown flux residue reduces visibility by the flow of residue at view point, and defects increases particularly in the visual inspection.

外観検査への影響

Selection of solder materials

Please contact us so we offer a Solder material which the color of the flux residue is suppressed dimmed by using pale rosin and less colored active agent.


Residue Cracking
Residue Cracking

Residue cracking is a phenomenon that thermal contraction and the stress like bending occurs cracking and peering of flux residue.

低温環境での使用、フレキ基板への実装

Problems of Residue Cracking

The Residue cracking makes itself absorb moisture, which leads to a decrease of the electrical reliability. In addition, the peeled flux entering into switch contacts will cause malfunction.


Countermeasures of Residue Cracking

The Countermeasures of residue cracking is cleaning of the substrate and the application of the coating agent, but both may increase the cost. To solve these problems, the resilient flux has been developed and applied to practical use. Please contact us so we offer a crack-proof type of flux cored solder wire.

low Ag Solder materials
Demand for low-Ag of solder alloy

The composition of the lead-free solder is currently the most widely used in the Sn-3.0Ag-0.5Cu, which contains 3% of Ag.
Precious metal Ag is expensive and Intense price fluctuations, so material cost in the implementation and risk of cost fluctuations rises.
For this reason, Introduction of low-Ag solder(decreased Ag) and no-Ag solder(no-use of Ag) makes a progress.


Function of Ag

The function of Ag in the solder is lower the melting point of the alloy, improve wettability and increasing the mechanical strength, fatigue strength and creep strength. It should be proceeded with the introduction, in the consideration that there is Low Ag solder applicable mounted article and no-applicable one.


Cases of introduction about low Ag and no-Ag solder

The implementation goods, which Low-Ag and No-Ag solder can be introduced, has the following features.

■Large size part, and use big amount of solder
Adopt cases: TV, home appliances, LED lighting and battery pack
■The part not to take the stress to the soldering point after implementation
Adopt cases: coil part of motors, (the coil is enough loose to absorb the stress)

Completion of wettability and workability by the flux

Low-Ag and no-Ag solder has less amount of Ag, neat it has poor wettability and workability compared to the Sn-3.0Ag-0.5Cu solder.  However, it is possible to secure a performance close to the Sn-3.0Ag-0.5Cu by supplement in combination with sufficient wettable flux. Please contact us so we offer the low-Ag and no-Ag type of FCSW and Solder paste

(JEITA鉛フリー化活動成果報告2007より)
Halogen-free solder
Background of Halogen-free

Incinerating electronic board including Cl, Br, which is halogen, sometimes creates dioxin which is harmful to organisms. For dioxin countermeasures, halogen-free is to regulate the halogen to be used in electronic board.


Function of halogen

In the case of solder material, we use halogen (Cl, Br, etc) in the flux, and enhance Solder wettability and workability.


Standard of halogen-free

Specific definition of halogen-free has is determined as by each industrial standard

Standard Threshold value
Japan electronics Packaging and Circuits Association (JPCA): JPCA-ES01
International Electrotechnical Commission: IEC61249-2-21
US IPC (US Association Connecting Electronics Industries): IPC4101B
Halogen content in Copper-clad laminate board materials
 Chlorine (Cl) content: 0.09wt% (900ppm) below
 Bromine (Br) content: 0.09wt% (900ppm) below
 Cl and Br content total: 0.15wt% (1500ppm) below
Japan Electronics and Information Technology Industries Association (JEITA):JEITA_ET-7304A Halogen content of the solder material flux solids in
 Fluorine (F) content: less than 0.1t% (1000ppm)
 Chlorine (Cl) content: less than 0.1t% (1000ppm)
 Bromine (Br) content: less than 0.1wt% (1000ppm)
 Iodine (I) content: less than 0.1wt% (1000ppm)

Our halogen-free solder
Type Standard Features Products
Completely halogen-free type JPCA-ES01
IEC61249-2-21
IPC4101B
JEITA_ET-7304A
No intentional addition of halogen.
In future, even if there is a change to the standard, it is as compatible.
Halogen-free standard compliant type JPCA-ES01
IEC61249-2-21
IPC4101B
Added halogen in the range of standards.
Compared to completely halogen-free type, it has higher wettability and workability.
Laser soldering
Features of Laser soldering

Two big reason to use laser soldering are as follows

  • ・Less maintenance due to a non-contact heating
  • ・Stable quality of the implementation due to less variability of solder amount.
Laser soldering

Absorption rate of laser

Infrared laser is used in Soldering. It is characterized by the fact that more of the organic matter has a higher absorption rate than metal. Therefore, sometimes the temperature of flux is higher than metal and wasted and evaporate before up to the temperature required solder alloy to melt in the laser soldering.


Material functions required for Laser soldering

For laser soldering, we have special FCSW and solder paste. We select less volatile base material for FCSW and for solder paste, add a high softening temperature material to avoid slump-in-heat in high temperature.

  • レーザー用はんだ材料 フラックスが全体を覆う

Please contact us so we offer the Solder materials applied in various implementation such as Point soldering, SMT, Printing, dispensing and so on.


Soldering to stainless steel
Can stainless steel be soldered ?

Stainless steel is solderable base material.
Sn in the solder joins Fe and Ni in stainless steal, so junction is completed.

High difficulty of soldering is caused by behavior of the oxide layer of stainless steel.


Problems when we do soldering

Oxide layer of stainless steel will inhibit soldering, while having a function of preventing rust.
In soldering on the surface of stainless steel, a new oxide layer is grown by heat and oxygen in the air, while the oxide layer is removed by flux. For this reason, you will need to complete the soldering in a short time before the oxide layer grows thicker.


Actual Procedure

Working in a short time requires a soldering iron or a solder pot of sufficient heat capacity.
In the case of soldering iron, set to 400 ℃, shed a iron to soldering point and supply at once a sufficient amount of solder at the same time, after that, continue to heat until it spread wet. In soldering to plate materials, an iron used to sold at D.I.Y. shop is not enough heat capacity. In this case, may use the gas burner or gas torch instead. In the case of solder pot, set to 250 ~ 300 ℃, apply the flux in the base material, put in solder quickly and then held until wet.

短時間で作業を行うために、十分な熱容量のはんだこて又ははんだポットが必要

Solder for stainless steel

Please contact us so we offer the non-cleaning type of FCSW for Stainless steel and powerful flux to be cleaned for Stainless steel.


fine wire erosion
Copper (Cu) erosion, fine wire erosion

Fine wire erosion is a phenomenon when line becomes finer, when soldering the coil wire such as relay components, earphones and a microphone. Severe cases lead to defects such as disconnection.

銅喰われ、細線喰われ
コイル線の銅がはんだに拡散
Coil wire

Cause of Cu erosion

Cu erosion occurs, because copper coil wire make a metallic compound with Sn of the solder and diffuses into the solder. Cu erosion occurs more often in Pb-free solder than Pb solder, because Pb-free solder contains more Sn than Pb solder.

銅喰われの原因

Countermeasures of Cu erosion

Adding a large amount of Cu in the solder alloy enables to reduce the Cu erosion, because it reduces the rate at which Cu diffuses from the coil wire. Please contact us so we offer the solder bar and FCSW for countermeasures of Cu erosion

Soldering to Aluminum coil
Problems of Soldering to Aluminum Coil

Aluminum is electrically base metal, easy to oxidize and occur the electrical corrosion. For this reason, in both during soldering and after soldering, unique problem exists in other base material.

はんだ付けしたアルミコイル
Soldered Aluminum coil

Problems when we do soldering

In soldering aluminum coil with dip pot, a large amount of dross may be generated, because solder-dissolved Al is combined to Sn and it is further oxidized. As a result, product quality and work efficiency decreases.


Problems after soldering

When use the common solder, after soldering, the battery is formed between Sn in solder and Al in wire, and the resulting electrolytic corrosion, joint strength and joint reliability are greatly reduced.


Solder materials for Aluminum Wire

Adding the additive elements to the solder enables to reduce dross in soldering and the electrolytic corrosion after soldering. Please contact us so we offer the Solder materials for dip soldering to aluminum coil and hand soldering


dross
The composition of the solder dross

Dross generated during the wave soldering, dip soldering are constructed about 10% of Sn oxide and about 90% of the solder in a state entangled. In other words, more than 90% of the dross is available to be recovered.

はんだドロスの構成物

Supression of Dross

Suppressing the phenomenon of Sn oxide and solder entangled enables to suppress dross. Reviewing a jet height of the solder bath and reducing the entrainment of air or oxides at bath surface enables to suppress dross. The additives to the solder enables to change the state of the oxide and suppress the generation of dross. . Please contact us so we offer the dross inhibitor for the solder pot

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