Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

石川金属株式会社

TÜV RHEINLAND認定

Management System
ISO 9001:2008
ISO 14001:2004

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Flux cored solder wire(Lead-free)

Good wettability type MFJ series モノタロウ
Good wettability with low Ag alloy

Good wettability with low Ag alloy can help to reduce material cost.

Good durability of wettability

Good solderbility can achieve higher productivity for various type parts

Reduce flux spattering

Select flux base material according to higher melting point of solder alloy.
Less spattering can achieve high performance soldering.

Less spattering

●Spattering test with soldering robot

MFJ series Other supplier's
MFJ series
Less spattering Many spattering
flux name MFJ
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R8(Sn-Cu0.7)
Flux contents (%) 3±0.3, 4±0.3, 6±0.3%
Flux type JIS-A、MIL-RMA
Halide contents 0.08~0.14%
Insulation resistance (Ω) Over 5.0×108Ω
Diameter
J3:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2, 0.15, 0.1
R4:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2
R8:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2
Less spattering type MYK series モノタロウ
Can apply with light beam soldering with low Ag

Selected materials suitable for rapid light heating achieves high workability. Good wettability with low Ag alloy can help to reduce cost.

Can apply with light beam soldering with low Ag

●Comparison with wetting area ratio after mounted
connector by light heating

R4-MYK-3
(Sn0.3Ag0.7Cu)
Wetting ratio : 98.3%
Can apply with light beam soldering with low Ag
Other supplier's
(Sn-3Ag-0.5Cu)
Wetting ratio : 63.0%

Low Ag cost down also by light beam soldering

Very few spattering

Select suitable flux base material for higher melting point alloy.
Very few spattering can achieve high performance soldering.

Tranparent flux residue

Good for after soldering appearance with transparent flux such as LED illumination.
Can achiece higher productivity for outlook inspection.

Tranparent flux residue, Good outlook

●Comparison with molten solder on selamic board

MYK series Other supplier's
MYK series
transparent light brown

  Can achieve higher quality for LED illumination

flux name MYK
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R8(Sn-Cu0.7)
Flux contents (%) 3±0.3, 4±0.3, 6±0.3%
Flux type JIS-A MIL-RMA
Halide contents 0.08~0.14%
Insulation resistance (Ω) Over 5.0×108Ω
Diameter
J3:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2, 0.15, 0.1
R4:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2
R8:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2
Compatible with stainless steel type ESK series モノタロウ
Strong wettability

Use a fluorine-based special active agent,
Strong active force produces good workability
for flame base material such as nickel and brass.

Good wettability for flame base material

●Wettability test for Ni pad

J3-ESK-3 Common product
Strong wettability
Good wettability No good

Good wettability enabls to shorten working time.

Also solderable to stainless

It is possible for robot soldering and hand soldering by iron.

even for stainless parts, which is difficult to solder

●Wettability test for stainless steel plate

J3-ESK-3 Common product
even for stainless parts, which is difficult to solder
Junction completed Non wetting

Good solderability also in stainless

Compatible to no-clean

Suppress the corrosion resistance to secure the reliability
after bonding.
Cleaning of flux reesidue is not required
like the general flux cored solder wire.

Compatible to no-clean

●Copper plate corrosion test

Initial 40℃、90%、after 96Hr
Compatible to no-clean
No corrosion

Strong activity and low corrosivity stand side by side.

flux name ESK
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
Flux contents (%) 3±0.3, 4±0.3, 6±0.3%
Flux type fluorine-based
Halide contents 0.1~0.4
Insulation resistance (Ω) Over 1.0×107Ω
Diameter
J3:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1
R4:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.25, 0.2
Non-cleaning type for aluminum EAN series
Solderable to aluminum

Use a special fluorine compound as the active agent.
A strong active force enables to solder to aluminum parts
which is so difficult to solder.

Solderable to aluminium

●Soldering example

0.04mm aluminium coil wire
Solderable to aluminum
1.0mm aluminium wire
Solderable to aluminum

Strong activity and low corrosivity stand side by side

Compatible to no-clean

Suppress the corrosion and achive to secure the reliability after soldering.
Cleaning of flux residue is not required like the general flux cored solder wire.

Compatible to no-clean

●Copper plate corrosion test

Initial 40℃、90%、after 96Hr
Compatible to no-clean
No corrosion

Strong activity and low corrosivity stand side by side

Progressive application

Enables to solder to aluminum wire, which was impossible in the
past, and to allow for the introduction of aluminum wire in a wide
range of applications.

Progressive application

●Applications

Progressive application
flux name EAN
Alloy type K4(Sn-Ag3.5-Ni0.2)
Pb-Sn18-Ag2
Flux contents (%) 3.0±0.3 2.5~3.0
Flux type fluorine-based
Halide contents below0.3
Insulation resistance (Ω) Over 5.0×108
Diameter
K4:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4
Residue crack preventing type DDL series
Joint develpment with DENSO

Full cooperation with Autmotive electrical equipment specialists in specification development and producti evaluation.
Coexistance at a high level about Reliability and workability

Good workability

●Wettability test by using soldering robot.

J3-DDL-4 Other supplier's
Prevent residue cracking
Good wettability No Good

Also capable for high difficulty implementation goods such as through-hole foudation.
【Condition】Iron mode : Line soldering
       Iron temp:350℃
       Iron speed : 10mm/s

Prevent residue cracking

The flexible residues prevent cracking due to thermal shock and vibration.
Omitting the step of applying coating material allows cost reduction.

Prevent residue cracking, No need coating material

●冷熱衝撃試験

J3-DDL-4 Other supplier's
Prevent residue cracking
No cracks Cracks

High reliability, no crack, no peeling after 1000 heat cycle test.
【Condition】 -30℃~110℃ 30min 1000cycles

Capable in various construction methods

Hand soldering, Iron robot, laser, etc., it can be used in various construction methods.
We can support a wide range of Diversified Implementation.

Capable for Beam Heating

●Wettability test for connector by using optical beam

J3-DDL-4
残渣割れを防止
Other supplier's
残渣割れを防止

Capable for rapid heating by light, stable wettability

flux name DDL
Alloy type J3(Sn-Ag3.0-Cu0.5)
Flux contents (%) 3±0.3, 4±0.3
Flux type JIS-AA
Halide contents 0.06~0.10
Insulation resistance (Ω) Over 1.0×109Ω
Diameter 1.6, 1.2, 1.0, 0.8, 0.6, 0.5
Completely halogen free type HFC series
Completely halogen-free

No halogen addition including Chlorine(Cl) and bromine(Br).
Halogen-free compliant with current all halogen-free standards.

Halogen-free compliant

●Compliant situation of HFC series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7904A Compliant

Compatible to all halogen-free standards

Good wettability

Adding a special active agents other than halogen.
Equivalnt wettability to Halogen-containing products.

Good wettability

●Soldering test with soldering robot.

J3-HFC-3(Halogen-free)Good
J3-HFC-3
Removing halogen from regular productNo good
ハロゲン含む特殊活性剤を抜いたもの
Regular type (Halogen-containing)Good
J3-HFC-3
  • Equivalent wettability to Halogen-containing products.
  • 【Condition】
  • Iron temp :400℃
    Iron speed:20mm/s
    PCB : Cu one side
Solderable to the flame base material

Good wettability even for nickel and brass.
You can solder to more diverse parts.

Solderable to the flame base material

●Wettability test for base material plate

Brass(270℃) Nickel(350℃)
Solderable to the flame base material
Good Good

Solderable various base material

flux name HFC
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R3(Sn-Cu0.55)
Flux contents (%) 3±0.3, 4±0.3, 6±0.3%
Flux type Halogen free
Halide contents Cl:below 0.005%
Br:below 0.01%
Insulation resistance (Ω) Over 1.0×109Ω
Diameter
J3:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2, 0.15, 0.1
R4:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2
R3:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2
Halogen free standard compliant type HFS series
Halogen free standard compliant type

No intentional addition of chlorine(Cl) and bromine(Br), which causes dioxins.
Compliant with Apple halogen-free standard.

Halogen-free compliant

●Compliant situation of HFS series.

Standards Compliant situation.
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Noncopliant

Compatible to major haloge-free standards

Good wettability

Adding a special active agents other than Cl and Br.
Good wettability, while compliant to halogen-free standards.

Good wettability

●Soldering test with soldering robot.

J3-HFC-3(Halogen-free)Good
J3-HFC-3
Other supplier's (Halogen-free)No Good
Other supplier's
Other supplier's (Haloge-containing)Good
Other supplier's (Haloge-containing)

(Back side of PCB)

Reduce flux spattering

The effect of special active agents reduce the spattering reducing the dirt of the board enables to secure a higher quality implementation.

Reduce flux spattering

●Spattering test with soldering robot

飛散を低減
flux name HFS
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R3(Sn-Cu0.55)
Flux contents (%) 3±0.3, 4±0.3, 6±0.3%
Flux type Halogen free
Halide contents Cl:below 0.005%
Br:below 0.01%
Insulation resistance (Ω) Over 1.0×109Ω
Diameter
J3:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2, 0.15, 0.1
R4:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2
R3:
1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2
Water soluble type WS111 series
Good wettability

Select flux activator according to base material.
Good solderbility can achieve higher productivity for various type parts.

Good wettability

●Comparison of solder bridge with line soldering

WS 111 series
WS 111 series
No bridge
Other supplier's
Other supplier's
Many bridges

Good wettability prevent solder bridge

Good water washability

A waterpsoluble base material is used instead of rosin.
The residue after soldering is possible to wash away easily with water.

Good water washability

●Ionic residue test

Sample Ionic residue(ugNaCl/in²)
WS111 series, before washing more than 50
WS111 series, after washing 11
blank 0.7

The flux residue is possible to clean with water

Reduce solder ball

The effect of special active agents reduce the solder ball.
Less solder ball can achieve high performance soldering.

Reduce solder ball

●Spattering test with solderring robot

WS111 series Other supplier's
はんだボール試験
Number of Solder balls :2 Number of Solder balls :72
flux name WS111
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R3(Sn-Cu0.55)
Flux contents (%) 2±0.3, 3±0.3, 4±0.3%
Flux type Water solubility type
Halide contents 1.6~2.4%
Insulation resistance (Ω) Over 1.0×108Ω(after cleaning with water)
Diameter J3:1.6, 1.2, 1.0, 0.8, 0.6, 0.5
J9:1.6, 1.2, 1.0, 0.8, 0.6, 0.5
Aluminum wire compliant type K4-C601-3
Compatible to aluminum wire

Solderable by iron to aluminum wire, used such as in the HDD of actuator.

Solderable to aluminum

●soldering test to aluminum

K4-C601-3
アルミへのはんだ付け性試験
Good No good

Solderable to aluminum

Put FCSW on aluminum board and heat by 270℃

Prevent electrolytic corrosion

Additive elements achieve high bonding reliability and prevent the galvanic corrosion that occurs between the aluminum material and solder.

High bonding reliability

●Electrolytic corrosion test

Electrolytic corrosion test
  • High corrosion life
    and bonding reliability
  • Measure the time until the
    solder delamination occurs,
    stored in 40 ℃ of artificial
    seawater, after soldering
    the two aluminum plates.
Good water washability

A water-soluble base material is used instead of rosin.
The residue after soldering is possible to wash away easily with water.

Good water washability

●Ionic residue test

Sample Ionic residue(ugNaCl/in²)
K4-C601-3 before washing more than 50
K4-C601-3 after washing 1.7
blank 0.7

The flux residue is possible to clean with water

【Test method】             
【Condition】Cleaning solution :Pure water Washing  temp:50℃
    Washing time :1 min  Number of washings :3

flux name C601
Alloy type K4(Sn-Ag3.5-Ni0.2)
Flux contents (%) 3±0.3
Flux type fluorine-based
Halide contents 17~23%
Insulation resistance (Ω) Over 1.0×109Ω
Diameter 1.6, 1.2, 1.0, 0.8, 0.6, 0.5
Flux cored solder wire(List)
flux name Alloy type Flux type Halide contents(%) Characteristics
MFJ J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R8(Sn-Cu0.7)
JIS A
MIL RMA
0.08~0.14 Good wettability
MYK J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R8(Sn-Cu0.7)
JIS A
MIL RMA
0.08~0.14 Less spattering
ESK J3(Sn-Ag3.0-Cu0.5) fluorine-based 0.1~0.4 Compatible with stainless steel
EAN K4(Sn-Ag3.5-Ni0.2)
Pb-Sn18-Ag2
JIS A
MIL RMA
below 0.3% Non-cleaning type for aluminum
DDL J3(Sn-Ag3.0-Cu0.5) JIS AA
MIL RMA
0.06~0.10 Residue crack preventing type
HFC J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R3(Sn-0.55Cu)
Halogen-free Cl:below 0.005%
Br:below 0.01%
Halogen-free
(Completely halogen free)
HFS J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
R3(Sn-0.55Cu)
Halogen-free Cl:below 0.005%
Br:below 0.01%
Halogen-free
(Iodine containing)
WSS111 J3(Sn-Ag3.0-Cu0.5)
J9(Sn-Ag3.5-Cu0.7)
Water soluble type 1.0 Water soluble type
K4-C601-3 K4(Sn-Ag3.5-Ni0.2) fluorine-based 17~23 Aluminum wire compliant type

Form number Wettability Spattering Residue crack
preventing type
Need to
wash ?
Compatible soldering
method
Compatible base material
Cupper Stainless steel Nickel Aluminum
MFJ series × No need Iron × ×
MYK series No need Iron, Laser × ×
ESK series × No need Iron, Laser ×
EAN series × No need Iron
DDL series No need Iron, Laser × ×
HFS series × No need Iron × ×
HFC series × No need Iron × ×
WSS111 series Needed Iron × ×
K4-C601-3 × Needed Iron

Solder paste(bottle,Lead-free)

Good wettability type 1001 series
Advanced Wettability

Higher heat resistance can educe defect of non-wetting and non-melting.
With these new features, can use low Ag type alloy similiar to usual SAC305 type alloy
and help to reduce the cost.

Good wettability

●High temparature preheating test

J3-1001-UG(3.0Ag) R4-1001-UG(0.3Ag)
High temparature preheating test
Good Good
Good transportability

Prevent quality deterioration during transportation

Good transportability

●35℃ deterioration test

35℃ deterioration test

Prevent quality deterioration during transportation

Long lasting stability

With new technology of controlling activator,
stable at long time printing and tranportation.

Good stability on continuous printing

●Confirmation of the shape of the printed solder paste

35℃で保管した際の粘度変化
flux name 1001
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
Powder particle size 38~20µm
Flux contents 12.0±1.0
weight 500g
Flux type MIL-RMA
Halide contents 0.02%
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 5.0×108Ω
Less void type 1002 series
Reduce void

Adding a component that facilitated that the gas in the molten solder comes out,
we reduce the occurrence of voids.

Reduce void

●Confirmation of voids in large parts.

1002 series Other supplier's
Confirmation of voids in large parts.
Less voids Many voids
  • Less voids in large parts
  • Condition:Atmospheric
    Pre heat :180℃, 120sec
    Component:6mm2 parts
Advanced Wettability

Higher heat resistance can reduce defect of non-wetting and non-melting.
With these new features, can use low Ag type alloy and help to reduce the cost.

Good wettability

●High temperature preheating test

1002 series Other supllier's
高温予熱でのぬれ性試験
Good No good
  • Good wettability in severe conditions
  • Condition:Atmospheric
    Pre heat :180℃, 120sec
    Component:0.4mm pitch QFP
Excellent viscosity stability

Less viscosity change in using.

Excellent viscosity stability

●Viscosity changes during continuous printing

Viscosity changes during continuous printing
flux name 1002
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
Powder particle size 38~20µm
Flux contents 12.0±1.0
weight 500g
Flux type MIL-RMA
Halide contents below 0.02
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 5.0×108Ω
Printing type for laser 8229 series
Suitable for Laser soldering

Suitable for Laser Heat soldering. Achieve a good finishing Quality, despite the rapid heating.

Reduce solder ball

●Solder ball test by laser heating

J3-8229-UE(3.0Ag) Other supplier's (3.0Ag)
レーザー加熱時のはんだボール試験
No solder ball Many solder ball
Brand-new process

Enable to adopt brand-new process combined LASER and printer
which can shorten the SMT processing time as reflow oven is not required.

Suitable for laser heating of SMT Package

●Laser SMT test of QFP parts

J3-8229-UE(3.0Ag) Other supplier's (3.0Ag)
QFP部品のレーザー実装試験
No solder ball Many solder ball
Printability

Enable to adopt into general use printer for SMT No special printer is required.

flux name 8229
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
Powder particle size 38~20µm
Flux contents 10.5±1.0
weight 500g
Flux type JIS-MIL-RMA
Halide contents 0.10~0.14%
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 5.0×108Ω

tranparent residue・LED Compliant type 8860 series
No color flux residue

Electing the colorless base matrial suppress the coloring of the residue.
Beautiful implementation appearance persists without discoloration associated with time.

No color flux residue achieve good outlook

●Comparison about residues after reflow

8860 series Other supplier's
リフロー後の残渣を比較
No color Brown color

Ensure high quality implementation in lighting fixtures such as LED lamps

Also match for Low Ag alloy

Corresponds to the low-Ag alloy, and already received the adoption experience.
Reducing the influence of metal market fluctiatios can be cost down.

Also match for Low Ag alloy

●The result of wetting with Low Ag (Sn-0.3Ag-0.7Cu) alloy

End of leads Back fillets
低Ag合金に対応
Good wettability Good wettability
  • Good wettability for low Ag
  • Condition:Atmospheric
    Pre heating : 150-170℃, 100sec
    Heating:230-255℃, 60sec
Electrically insulating at high temperatures

Optimization of the type and amount of active agent keeps
the Insulative even at high temperatures,
Malfunction of the LED lighting equipment is
prevented under extreme environment.

High Insulative even at high temperature

●Insulation resistance test at 85 and 120

85℃、120℃でInsulation resistance (Ω)を測定
flux name 8860
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
Powder particle size 38~20µm
Flux contents 11.7±1.0
weight 500g
Flux type MIL-RMA
Halide contents below 0.05
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 5.0×108Ω
High reliability type for automotive 1500 series
Prevent Residue cracking

Adding special resin to flux bring elasticity to the residue.
Prevent cracking and deterioration of insulation resistance associated with it.

Prevent Residue cracking

●Thermal shock test (QFP shooting transmitted light)

J3-1500-UG
No cracking
冷熱衝撃試験(QFGを透過光で撮影)
Conventional products
Cracking occurs

【Condition】-40〜80℃ 30min 168cycles, 0.5mm pitch QFP

A high electrical reliability

Select the base resin and the active agent with an emphasis on electrical reliability.

A high electrical reliability

●Insulation resistance test

Insulation resistance (Ω)試験

Achieve a high insulation resistance value than conventional products.
【Conditions】PCB : JIS-Ⅱ Test voltage : 100V Temp. 85℃ Humidty 85%

Long lasting stability

With new technology of controlling activator at room temperature, stable at long time printing and transportation.

Long lasting stability

●Viscosity stability in long continuous printing (Bottle)

  • 長時間連続印刷時の粘度安定性(ボトル)
  • 【Conditions】
    Temp : 25℃
    Humidity : 50%
    Squeegee : Urethane
    Squeegee : 200mm
    Print length : 250mm
    Paste weight 500g

●Discharge stability in continuous use (Syringe)

  • 長時間連続印刷時の粘度安定性(ボトル)
  • 【Conditions】
    Syringe volume : 30ml
    Needle bore : 1.25mm
    Needle length : 13mm
    Material of Needle : SUS
    Pressure : 0.113MPa
    Shot time : 0.5sec
    Shot interval : 1sec
    Test temp : 25℃

Small variations in viscosity and the discharge amount can be stable impletation.

Type Bottle Syringe
flux name 1500
Alloy type J3(Sn-Ag3.0-Cu0.5)
Powder particle size 38~20
Flux contents 12.0±1.0 14.0±1.0
weight 500 100
Flux type JIS-AA
Halide contents below 0.02%
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance/th> Over 1.0×109

Halogen free standard compliant type 8850 series
Compatible to halogen-free standards

Compatible with the halogen-free standard of J-STD-709,
without adding chlorine (Cl) and bromine (Br), which cause dioxins

halogen-free standards
Threshold
the halogen content in the copper-clad laminate is
 Content of chlorine (C) : below 0.09 wt% (900 ppm)
 Content of bromine (Br) : below 0.09 wt% (900 ppm)
 Total content of chlorine (C) and bromine (Br): below 0.15 wt% (1500 ppm)
Good wettability, can apply with low Ag alloy

By using special active agent, low Ag alloy can be used.
Archive both halogen-free and cost reduction compatibility.

Good wettability and apply with low Ag

●Wettability test with high temperature preheating

J3-8850-UG(Sn-Ag-Cu) R4-8850-UG(低Ag)
Wettability test with high temperature preheating
Good Good
  • Low Ag alloy can be same wettability as 3Ag
  • Atmosphere: Air
    Parts: QFP
        0.5 mm pitch
Less chip side ball

Good heat resistance of the flux apply with low Ag easily.
Reducing the influence of metal price fluctuations, can do cost reduction

Less chip side ball

●Chip side ball test after reflow (3216 chips)

8850 series Other company's products
リフロー後のチップサイドボール試験(3216チップ)
リフロー後のチップサイドボール試験(3216チップ)

Reduce chip side balls and ensure mounting quality

flux name 8850
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
Powder particle size 38~20µm
Flux contents 11.5±1.0%
weight 500g
Flux type MIL-RMA
Halide contents below 0.01
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 5.0×108Ω

Completely halogen free type 7000 series
Completely halogen free

Any halogen is not added including Chlorine (Cl), bromine (Br).
Compatible with all current halogen-free standards.

Completely halogen free standard compliant
Halogen content in flux of solder material is
 Fluorine (F) content: less than 0.1 t% (1000 ppm)
 Chlorine (C) content: less than 0.1 t% (1000 ppm)
 Bromine (Br) content: less than 0.1 wt% (1000 ppm)
 Iodine (I) content: less than 0.1 wt% (1000 ppm)
Good wettability

Use special active agents other than halogen.
The same wettability as the product containing halogen.

Good wettability

●Wettability test

J3-7000-UG Halogen-containing products
Wettability test
Good Good

Wettability equivalent to that of halogen-containing products

【Condition】
 Atmosphere: Air
 Parts: QFP
     0.5 mm pitch

High stability for printing

Preventing the reaction of flux and powder makes viscosity not to
change during continuous printing and enables for stable mounting

High stability for continuous printing

●Check the print shape

  • 印刷形状を確認
    initial
  • 印刷形状を確認
    500 sheets
  • 印刷形状を確認
    1000 sheets
  • 【Conditions】
     0.4 mm pitch QFP
     Printing speed: 30 mm / s
     Squeegee: Urethane
     Mask thickness: 0.12 mm

Stable shape after long-term continuous printing

flux name 7000
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
Powder particle size 38~20µm
Flux contents 11.8±0.5
weight 500g
Flux type MIL-RMA
Halide contents (Cl) 0.09% or less
(Br) 0.09% or less
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 5.0×108Ω

Less residue type 6001 series
  1. 1, Reducing the residual flux after reflow enables to improve the direct rate of continuity test. Contribute to improving efficiency of productivity.
  2. 2, Solving various problems considered low residue type solder paste enebles to improve mounting accuracy in N2 atmosphere.
  3. 3, Designing the flux as low residue type makes the appearance clean, and reduce the maintenance frequency of N 2 reflow equipment
flux name 6001
Alloy type J3(Sn-Ag3.0-Cu0.5)
Powder particle size 45~25µm
Flux contents 10.5±0.5
weight 500g
Flux type MIL-RMA
Halide content 0.03±0.02%
Copper plate・Copper mirror corrosion test No Corrosion
Insulation resistance Over 5.0×108Ω

Solder paste (syringe,Lead-free)

Dispensing type for laser 3229 series
Prevent solder balls

Use a special active agent that enables rapid heating mounting by light.
Reduce sagging during heating and solve the problem of solder balls.

Prevent solder balls

●Comparison of solder balls by laser heating

3229 series Ordinaly products
レーザー加熱によるソルダボールの比較
No occurrence Many solder balls
  • The solder ball does not come out even by rapid heating
  • 1608 Capacitor chip
    laser output: 8W
Also apply large parts

Apply large and small parts from chip to connector. It enables mounting of complicated boards.

Also apply large parts

●Compare solder balls when mounting connector parts

3229 series Ordinary items
コネクタ部品実装時のはんだボールを比較
No occurrence Many solder ball
Adoption experience in automotive

It has been adopted for mounting onboard electrical equipment since the time of Sn-Pb.
Ideal for users who require more stringent mounting quality and reliability.

Reduction of sagging during rapid heating

●Confirm shape during light heating

3229 series Ordinally products
光加熱時の形状を確認
Maintain shapes Bridge occurrence

There is no sagging, preventing large bridge parts

flux name 3229
Alloy type J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
Powder particle size 45~25、38~20µm
Flux contents 14.0±0.5%
Flux type MIL-RMA
Copper plate・Copper mirror corrosion No Corrosion
Halide contents 0.08~0.10
weight 40g
Insulation resistance Over 5.0×108Ω

Completely halogen free type 3700 series
Completely halogen free

Not adding any halogens including chlorine (Cl), bromine (Br).
Compatible with all current halogen-free standards.

Halogen free standard compatible

●Status of HFS series compliance

standard Correspondence situation
JPCA-ES01 Correspondence
IEC61249-2-21 Correspondence
IPC4101B Correspondence
JEITA ET-7304A Correspondence

Supports all halogen-free standards

Stable injection

Preventing the reaction of flux and powder.
High coating stability is realized even with small injection.

Stable injection

●Continuous injection Test

連続吐出試験

Stable Injection volume

Prevent solder balls

Use a special active agent that enables rapid heating mounting by light.
Reduce sagging during heating and solve the problem of solder balls.

Prevent solder balls

●Comparison of solder balls by light beam heating

3700 series 光ビーム加熱によるソルダボールの比較
Ordinary products
  • The solder ball does not come
    out even by rapid heating
  • 1608 resistance chip
    Beam output: 30 W
flux name 3700
Alloy type J3(Sn-Ag3.0-Cu0.5)
Powder particle size 45~25、38~25、32~15µm
Flux contents 14.0±0.5、14.5±0.3%
Flux type halogen free
Copper plate・Copper mirror corrosion No Corrosion
Halide contents Cl: less than 0.005%
Br: less than 0.01%
weight 40g
Insulation resistance Over 5.0×108Ω

Fine powder compliant type for laser 3230 series
Specialized in micro parts

Designed exclusively for compliance with mounting of small parts. We will solve problems unique to micro parts.

Design for micro parts only

Evasol 3230 series is designed exclusively for micro parts.
Please use 3229 series for large parts.

●Application
  1608 or less chip parts
  Smartphone camera module etc.
●Non-adaptable cases
  Insertion parts, connectors

Prevent solder balls

Use a special active agent that enables rapid heating mounting by light.
Reduce sagging during heating and solve the problem of solder balls.

Prevent solder balls

●Comparison of solder balls by light beam heating

3230 series 光ビーム加熱によるソルダボールの比較
Ordinally products
  • The solder ball does not come out even by rapid heating
  • 1608 resistance chip
    Beam output: 40 W
Stable injection

Preventing the reaction of flux and powder.
High stability for coating is realized even with slight injection.

Stable injection

●Continuous Injection Test

連続吐出試験

Stable injection volume

flux name 3230
Alloy type J3(Sn-Ag3.0-Cu0.5)
Powder particle size 38~25、38~20、32~15µm
Flux contents 14.0±0.5、14.5±0.3
weight 40g
Flux type MIL-RMA
Halide contents 0.08~0.10
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 1.0×108Ω

High viscosity type 3240 series

Adjusted high viscosity prevents sagging and solder balls during rapid heating.
Compatible with optical heating and ideal for mounting large parts such as connector parts.

flux name 3240
Alloy type J3(Sn-Ag3.0-Cu0.5)
Powder particle size 38~25µm
Flux contents 14.0±0.5%
weight 40g
Flux type MIL-RMA
Halide contents 0.07~0.11%
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 1.0×108Ω

Low melting point alloy compliant type 2020 series

A solder paste combining a low melting point alloy and a heat-resistant flux.
Ideal for mounting of irregular shaped parts such as optical parts housings and low heat resistant parts.

flux name 2020
Alloy type Sn42-Bi
Powder particle size 45~25µm
Flux contents 10.0±0.5%
weight 40g
Flux type MIL-RA
Halide contents 0.20
Copper plate・Copper mirror corrosion No Corrosion
Insulation resistance Over 1.0×108Ω
Solder paste (Bottle)【List】
flux name Solder alloy Flux type Halide contents(%) Characteristic
1001 J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
MIL-RMA 0.02% Emphasis on wettability
1002 J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
MIL-RMA 0.02% Void reduction type
8229 J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
MIL-RMA 0.10~0.14% Printing type for laser
8860 J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
MIL-RMA 0.05% or less Printing type for laser
1500 J3(Sn-Ag3.0-Cu0.5) JIS-AA 0.02% or less High reliability type for automotive
8850 J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
MIL-RMA 0.01% or less Halogen-free standard compliant type
7000 J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag0.3-Cu0.7)
MIL-RMA (Cl)0.09% or less
(Br)0.09% or less
Completely halogen-free type
6001 J3(Sn-Ag3.0-Cu0.5) MIL-RMA 0.03% or less Low residual type
Solder paste (syringe)【List】
flux name Solder alloy Flux type Halide contents(%) Characteristic
3229 J3(Sn-Ag3.0-Cu0.5)
R4(Sn-Ag3.0-Cu0.7)
MIL-RMA 0.08~0.10% Injection type for laser
3700 J3(Sn-Ag3.0-Cu0.5) Halogen-free (Cl)less than 0.005%
(Br)<0.01%
Completely halogen free type
1500 J3(Sn-Ag3.0-Cu0.5) JIS-AA 0.02% or less High reliabllity type for automotive
3230 J3(Sn-Ag3.0-Cu0.5) MIL-RMA 0.08~0.10% Fine powder compatible type for laser
3240 J3(Sn-Ag3.0-Cu0.5) MIL-RMA 0.07~0.11% High viscosity type
2020 J3(Sn-Ag3.0-Cu0.5) MIL-RA 0.20% Low melting point alloy compatible type

Solder bar(Lead-free)

Aluminum compliant type K4S
Prevent electrolytic corrosion

Additive elements prevent electrolytic corrosion generated
between aluminum material and solder and high bonding
reliability is realized.

High joining reliability line

●Corrosion Life Test

Corrosion Life Test
  • Long Corrosion life
    High bonding reliability
  • After soldering the two aluminum plates, keep them
    in artificial seawater at 40 ℃,
    Measure the time until solder peeling occurs.
High working stability

Suppresses the dross occurrence which becomes a problem especially in terminal treatment of aluminum wire. Reduce the number of replacement of solder baths to ensure work efficiency.

Reduction of dross by aluminum

●Soldering mass production test

Soldering mass production test

Stable soldering possible for a long time
    Tank temperature: 400 ℃

Compatible aluminum wire

It can be used for terminal treatment by dipping bath of aluminum wire which rapidly spread to air conditioner compressor etc.

Apply to terminal processing of aluminum wire

●Example of soldering of aluminum wire and copper wire

  • Example of soldering of aluminum wire and copper wire
  • 【appearance】



    Good soldering condition
  • アルミワイヤと銅ワイヤのはんだ付け例
  • 【cross section】

    Both aluminum and copper are uniformly wet

    Temperature of bath: 390 ℃
    Wire diameter:Ø1mm
Solder composition(%) Sn- Ag 3.5-Ni0.4
Solidus temperature(℃) 220
Liquidus temperature (℃) 348
Tensile strength (MPa) 43.3
Elongation(%) 38.1
Vickers hardness(16.4) 16.4
Electrical Specific Resistance(µΩm) 0.153
Alloy line up
Alloy name Alloy composition Melting point(℃) Usage
Solidus
temperature
Liquidus
temperature
S1 Sn 232
A2 Sn-5Sb 235 240
K2 Sn-3.5Ag 221 Sn-Ag eutectic alloy
K3 Sn-3.0Ag 221 222 For additional input when Sn - 3.0 Ag - 0.5 Cu in a dip tank.
K5 Sn-0.3Ag 221 231 For additional input when Sn - 0.3 Ag - 0.7 Cu in a dip tank.
K7 Sn-1Ag 221 228 For additional input when Sn - 1.0 Ag - 0.7 Cu in a dip tank.
J2 Sn-3.5Ag-0.55Cu 217 220
J3 Sn-3.0Ag-0.5Cu 217 220 JEITA recommended alloy
J7 Sn-1Ag-0.7Cu 217 224 Low silver solder alloy
F2 Sn-1.5Ag-0.85Cu-2.0Bi 210 223
F6 Sn-2.5Ag-0.5Cu-1.0Bi 213 218
R2 Sn-0.55Cu 226 Sn-Cu eutectic alloy
R3 Sn-0.55Cu-β 226 R2 wetting countermeasure item
R4 Sn-0.3Ag-0.7Cu 217 226 JEITA recommended low silver solder alloy
R23 Sn-3.0Cu 227 309 Copper eating measures
R25 Sn-5.0Cu 227 358 Copper eating measures (for dip)

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