Solder paste (bottle)
Halogen free less spattering type 8850 series
Good wettability, applicable to low-Ag solder
The special activater enables to use low-Ag alloy.Achieves both of halogen-free and cost reduction.
Good wettability for both of 3％ Ag and low Ag
●High temperature preheating test
Low Ag alloy has euivalent wettability to 3Ag
Condition:Atmospheric
Component:QFP
0.5mm pitch
Reduce the chip side balls
Easily applicable to low Ag for the improved heat resistance of the flux.It may help to reduce the cost.
Reduce the chip side balls
●Chip side ball test after reflow(3216 chip)
Reduce the chip side ball, ensure the good SMT quality
Reduce flux spattering
Selecting proper activator achieved less flux spattering during reflow soldering
Less flux spattering
●Spattering test with reflow
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | Halogen free |
| Halide contents | Less than 0.02% |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 11.5% |
| Deterioration（Pa・S） | 190 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 900 Br : Less than 900 |
| Flux name | 8850 |
