Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (bottle)

Halogen free less spattering type 8850 series
Good wettability, applicable to low-Ag solder

The special activater enables to use low-Ag alloy.Achieves both of halogen-free and cost reduction.

Good wettability for both of 3% Ag and low Ag

●High temperature preheating test

Low Ag alloy has euivalent wettability to 3Ag
Condition:Atmospheric
Component:QFP
0.5mm pitch

Reduce the chip side balls

Easily applicable to low Ag for the improved heat resistance of the flux.It may help to reduce the cost.

Reduce the chip side balls

●Chip side ball test after reflow(3216 chip)

Reduce the chip side ball, ensure the good SMT quality

Reduce flux spattering

Selecting proper activator achieved less flux spattering during reflow soldering

Less flux spattering

●Spattering test with reflow

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type Halogen free
Halide contents Less than 0.02%
Powder particle size(μm) 38~20(Type 4)
Flux contents(%) 11.5%
Deterioration(Pa・S) 190
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Halogen contents(ppm) Cl : Less than 900
Br : Less than 900
Flux name 8850

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