Flux cored solder wire
Good wettability Halogen free standard compliant type EYP series
Correspond to LASER soldering
Suitable materials for rapid heating by LASER.Sufficient wettability even at low output, and reduces heat damage to the mounted components.
Good workability for flame base material
●Wettability test by light beam to Ni
Ensures good wettability even at low output
【Condition】
Beam power:22W
Wire diameter:φ0.8mm Preheat:0.2s
Feed:5mm/s, 1.0s
Postheat:0.2s
Pad:Ni, 3mm■
Halogen-free compliant
No intentional addition of chlorine(Cl) and bromine(Br), Which causes dioxins.Compliant with most of halogen-free standards.
Halogen-free compliant
●Compliant situation of EYP series
![](https://system.web-thorugh.jp/ishikawa_metal/uploads/evasol/113/""_m.)
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non compliant |
Comply to major halogen-free standards
Very few spattering
Apply suitable flux base material for higher melting point alloy.Very few flux spattering can achieve high performance soldering.
Very few spattering
●Flux spattering test by using soldering iron robot
Reduce flux spattering
-
Collect spattered flux onto
thermal paper【Condition】
Iron temp:380℃
Feed speed:15mm/s
Feed length:5mm × 200shots
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen-free type |
| Flux contents (%) | 3.0％、4.0％、6.0％ |
| Halide contents | 0.1%～0.6% |
| Copper plate corrosion test | No corrosion |
| Insulation resistance（Ω） | More than 1.0×107Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | EYP |
