Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Flux cored solder wire

Good wettability Halogen free standard compliant type EYP series
Correspond to LASER soldering

Suitable materials for rapid heating by LASER.Sufficient wettability even at low output, and reduces heat damage to the mounted components.

Good workability for flame base material

●Wettability test by light beam to Ni

Ensures good wettability even at low output
【Condition】
Beam power:22W
Wire diameter:φ0.8mm Preheat:0.2s
Feed:5mm/s, 1.0s
Postheat:0.2s
Pad:Ni, 3mm■

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), Which causes dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of EYP series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Non compliant

Comply to major halogen-free standards

Very few spattering

Apply suitable flux base material for higher melting point alloy.Very few flux spattering can achieve high performance soldering.

Very few spattering

●Flux spattering test by using soldering iron robot

Reduce flux spattering

  • Collect spattered flux onto
    thermal paper

    【Condition】
    Iron temp:380℃
    Feed speed:15mm/s
    Feed length:5mm × 200shots

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type Halogen-free type
Flux contents (%) 3.0%、4.0%、6.0%
Halide contents 0.1%~0.6%
Copper plate corrosion test No corrosion
Insulation resistance(Ω) More than 1.0×107Ω
Electrochemical migration No migration
Halogen contents(ppm) Cl : Less than 50
Br : Less than 100
Flux name EYP

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