Solder paste (bottle)
Completely halogen free type 7100 series
Long lasting printing stability
Prevents the reaction of the flux and powder, in order to prevent the viscosity increasement during continuous printing.Enable to implement stability.
Good stability on continuous printing
●Confirmation of the shape of the printed solder paste
Stable shape after long time printing
Completely halogen-free
No halogen addition including Chlorine(Cl) and bromine(Br).Halogen-free compliant with curent all halogen-free standards.
Halogen-free compliant
●Compliant situation of 7100 series
![](https://system.web-thorugh.jp/ishikawa_metal/uploads/evasol/66/""_m.)
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Compliant |
Comply to all of halogen free standards
Reduce void
Adding material which facilitated that the gas in the molten solder comes out, it may reduce the remaining of voids.
Reduce void
●Confimation of voids in large parts
Less void in large parts
Condition:Atmospheric
Pre heat:180℃,120 seconds
Component:6mm■ parts
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | 0% |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 11.5% |
| Deterioration（Pa・S） | 180 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | 7100 |
