Solder bar・Solder wire
Alloy line up
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| Alloy name | Alloy composition | Melting point(℃) | Usage | |
|---|---|---|---|---|
| Solidus temperature |
Liquidus temperature |
|||
| S1 | Sn | 232 | ||
| A2 | Sn-5Sb | 235 | 240 | |
| K2 | Sn-3.5Ag | 221 | Sn-Ag eutectic alloy | |
| K3 | Sn-3.0Ag | 221 | 222 | For additional input when Sn - 3.0 Ag - 0.5 Cu in a dip tank. |
| K5 | Sn-0.3Ag | 221 | 231 | For additional input when Sn - 0.3 Ag - 0.7 Cu in a dip tank. |
| K7 | Sn-1Ag | 221 | 228 | For additional input when Sn - 1.0 Ag - 0.7 Cu in a dip tank. |
| J2 | Sn-3.5Ag-0.55Cu | 217 | 220 | |
| J3 | Sn-3.0Ag-0.5Cu | 217 | 220 | JEITA recommended alloy |
| J7 | Sn-1Ag-0.7Cu | 217 | 224 | Low silver solder alloy |
| F2 | Sn-1.5Ag-0.85Cu-2.0Bi | 210 | 223 | |
| F6 | Sn-2.5Ag-0.5Cu-1.0Bi | 213 | 218 | |
| R2 | Sn-0.55Cu | 226 | Sn-Cu eutectic alloy | |
| R3 | Sn-0.55Cu-β | 226 | R2 wetting countermeasure item | |
| R4 | Sn-0.3Ag-0.7Cu | 217 | 226 | JEITA recommended low silver solder alloy |
| R23 | Sn-3.0Cu | 227 | 309 | Copper eating measures |
| R25 | Sn-5.0Cu | 227 | 358 | Copper eating measures (for dip) |
