Flux cored solder wire
Less spattering type MYK series
Very few spattering
Select suitable flux base material for higher melting point alloy.Very few flux spattering can achieve high performance soldering.
Very few spattering
●Flux spattering test by using soldering iron robot
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Can apply with LASER soldering with low Ag
Selected materials suitable for rapid light heating achieves high workability. Good wettability with low Ag alloy can help to reduce cost.
Can apply with LASER soldering with low Ag
●Confirmation of wettability with LASER soldering
【Condition】
Beam power:40W Wire diameter:φ0.8mm
Preheat:0.05 Wire feed:7mm/s,1.6s
Postheating:0.3s PCB:Cu,one side
Connector terminal:Brass,Sn plating on Ni
Tranparent flux residue
Good for after soldering appearance with transparent flux such as LED illumination.Can achiece higher productivity for outlook inspection.
Good outlook after soldering
●Put solder on white ceramic plate and heat with 270℃
Can achieve higher productivity for outlook inspection
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7) |
|---|---|
| Flux type | JIS-A MIL-RMA |
| Flux contents (%) | 3.0％、4.0％、6.0％ |
| Halide contents | 0.08%～0.14% |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | MYK |
