Flux cored solder wire
Non-cleaning type for stainless steel,nickel,brass ESK series
Solderable to stainless steel
Possible for robot soldering and hand soldering by iron, even for stainless steel parts which is difficult to solder.
Solderable to stainless steel
●Wettability test for stainless steel plate
Good solderability also in stainless steel
【Condition】
Iron temp:380℃
Base material:SUS304
Strong wettability
Use a fluorine-based special activater. Strong activation force produces good workability for flame base material such as nickel and brass.
Good workability for flame base material
●Wettability test for Ni pad
Good wettability enabls to shorten working time.
【Condition】
Iron temp:370℃
Pad:Ni,3mm■
Soldering time:2.5s/point
Non-clean
Suppress the corrosion to secure the reliability after solderig.Cleaning of flux residue is not required like the general flux cored solder wire.
Non-clean
●Copper plate corrosion test
Strong activity and low corrosivity stand side by side
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | Fluorine type |
| Flux contents (%) | 3.0％、4.0％、6.0％ |
| Halide contents | 0.1％～0.4％ |
| Copper plate corrosion test | No corrosion |
| Insulation resistance（Ω） | More than 1.0×107Ω |
| Electrochemical migration | No migration |
| Fluorine contents（％） | 0.2％～0.4％ |
| Flux name | ESK |
