Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (bottle)

Good wettability type 1001 series
Advanced wettability

Higher heat resistance can reduce defect of non-wetting and non-melting

Good wettability

●High temperature preheating test

Good wettability in severe conditions
Condition:Atmospheric
Pre heat:200℃ 120 seconds
Component:0.4mm pitch QFP φ0.30mm dot

Good transportability

Prevent quality deterioration during transportation.

Good transportability

●35℃ deterioration test

Prevent quality deterioration during transportation

Long lasting stability

With new technology of controlling activator at room temperature, stable at long time printing and transportation.

Good stability on continuous printing

●Confirmation of the shape of the printed solder paste

Stable shape after long time printing
J3-1001-UG(3Ag)
0.4mm pitch QFP
Stencil thickness:0.12mm

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type MIL-RMA
Halide contents Less than 0.02%
Powder particle size(μm) 38~20(Type 4)
Flux contents(%) 12.0%
Deterioration(Pa・S) 190
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Flux name 1001

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