Solder paste (bottle)
Good wettability type 1001 series
Advanced wettability
Higher heat resistance can reduce defect of non-wetting and non-melting
Good wettability
●High temperature preheating test
Good wettability in severe conditions
Condition:Atmospheric
Pre heat:200℃ 120 seconds
Component:0.4mm pitch QFP φ0.30mm dot
Good transportability
Prevent quality deterioration during transportation.
Good transportability
●35℃ deterioration test
Prevent quality deterioration during transportation
Long lasting stability
With new technology of controlling activator at room temperature, stable at long time printing and transportation.
Good stability on continuous printing
●Confirmation of the shape of the printed solder paste
Stable shape after long time printing
J3-1001-UG(3Ag)
0.4mm pitch QFP
Stencil thickness:0.12mm
Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
---|---|
Flux type | MIL-RMA |
Halide contents | Less than 0.02% |
Powder particle size(μm) | 38~20(Type 4) |
Flux contents(%) | 12.0% |
Deterioration(Pa・S) | 190 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | More than 5.0×108Ω |
Electrochemical migration | No migration |
Flux name | 1001 |