Solder paste (bottle)
Halogen free standard compliant printng type for LASER 8239 series
Suitable for LASER soldering
Suitable for LASER heat soldering.Achieve a good soldering quality, with avoiding satelite balls.
Reduce solder ball
●Solder ball test by LASER heating
Few solder ball occurs by rapid heating in short time
Irradiation time:0.2 sec
Parts:1005R chip
Halogen-free compliant
No intentional addition of chlorine(Cl) and bromine(Br), which genelate dioxins.Compliant with most of halogen-free standards.
Halogen-free compliant
●Compliant situation of 8239 series
Standards | Compliant situation |
---|---|
JPCA-ES01 | Compliant |
IEC61249-2-21 | Compliant |
IPC4101B | Compliant |
JEITA ET-7304A | Non compliant |
Comply to major halogen-free standards
Brand-new process
Enable to adopt brand-new process combined LASER and printer which can shorten the SMT processing time as reflow oven is not required.
Stable viscosity
●Viscosity test of continuous printing
Stable viscosity of continuous printing
Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
---|---|
Flux type | Halogen free |
Halide contents | 0.10%~0.14% |
Powder particle size(μm) | 38~20(Type 4) |
Flux contents(%) | 10.5% |
Deterioration(Pa・S) | 230 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | More than 1.0×109Ω |
Electrochemical migration | No migraiton |
Halogen contents(ppm) | Cl : Less than 50 Br : Less than 100 |
Flux name | 8239 |