Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD


Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159


Solder paste (bottle)

Halogen free standard compliant printng type for LASER 8239 series
Suitable for LASER soldering

Suitable for LASER heat soldering.Achieve a good soldering quality, with avoiding satelite balls.

Reduce solder ball

●Solder ball test by LASER heating

Few solder ball occurs by rapid heating in short time
Irradiation time:0.2 sec
Parts:1005R chip

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which genelate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of 8239 series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Non compliant

Comply to major halogen-free standards

Brand-new process

Enable to adopt brand-new process combined LASER and printer which can shorten the SMT processing time as reflow oven is not required.

Stable viscosity

●Viscosity test of continuous printing

Stable viscosity of continuous printing

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type Halogen free
Halide contents 0.10%~0.14%
Powder particle size(μm) 38~20(Type 4)
Flux contents(%) 10.5%
Deterioration(Pa・S) 230
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migraiton
Halogen contents(ppm) Cl : Less than 50
Br : Less than 100
Flux name 8239

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