Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (syringe)

For micro components 3230 series
Reduce solder ball

Special activator enables rapid heating SMT by LASER .Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating.
1608R chip
Beam power:40W

Specialize in the SMT of micro-components.

Special designed for the soldering of micro-components, Solution for peculiar problems of micro components.

Special designed for micro-components

EVASOL 3230 series is special designed for micro-components.Please use the 3229 series for large parts.


●Applicable example
             Smaller chip components than 1608
             Camera module of smartphone etc.

●Inapplicable example
              Through-hole parts, connectors
Good dispensing stability

Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.

Good dispensing stability

●Continuous dispense test

Stable dispense volume

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type MIL-RMA
Halide contents 0.08%~0.1%
Powder particle size(μm) 38~20(Type 4)
Flux contents(%) 14.5%
Deterioration(Pa・S) 100
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 1.0×108Ω
Electrochemical migration No migration
Flux name 3230

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