Solder paste (syringe)
For micro components 3230 series
Reduce solder ball
Special activator enables rapid heating SMT by LASER .Solution of solder ball by reducing slumps in heat.
Reduce solder ball
●Comparison of solder ball
No solder ball by rapid heating.
1608R chip
Beam power:40W
Specialize in the SMT of micro-components.
Special designed for the soldering of micro-components, Solution for peculiar problems of micro components.
Special designed for micro-components
EVASOL 3230 series is special designed for micro-components.Please use the 3229 series for large parts.
●Applicable example
Smaller chip components than 1608
Camera module of smartphone etc.
●Inapplicable example
Through-hole parts, connectors
Good dispensing stability
Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.
Good dispensing stability
●Continuous dispense test
Stable dispense volume
Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
---|---|
Flux type | MIL-RMA |
Halide contents | 0.08%~0.1% |
Powder particle size(μm) | 38~20(Type 4) |
Flux contents(%) | 14.5% |
Deterioration(Pa・S) | 100 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | More than 1.0×108Ω |
Electrochemical migration | No migration |
Flux name | 3230 |