Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (syringe)

Completely halogen free type 3700 series
Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
1608R chip
Beam power:30W

Completely halogen-free

No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with curent all halogen-free standards.

Halogen-free compliant

●Compliant situation of 3700 series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Compliant

Comply to all of halogen free standards

Good dispensing stability

Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.

Good dispensing stability

●Continuous dispense test

Stable dispense volume

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type Halogen free
Halide contents 0%
Powder particle size(μm) 45~25(Type 3)
38~20(Type 4)
Flux contents(%) 14.5%
Deterioration(Pa・S) 130
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 1.0×108Ω
Electrochemical migration No migration
Halogen contents(ppm) Cl : Less than 50
Br : Less than 100
Flux name 3700

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