Solder paste (syringe)
Completely halogen free type 3700 series
Reduce solder ball
Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.
Reduce solder ball
●Comparison of solder ball
No solder ball by rapid heating
1608R chip
Beam power:30W
Completely halogen-free
No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with curent all halogen-free standards.
Halogen-free compliant
●Compliant situation of 3700 series
![](https://system.web-thorugh.jp/ishikawa_metal/uploads/evasol/104/""_m.)
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Compliant |
Comply to all of halogen free standards
Good dispensing stability
Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.
Good dispensing stability
●Continuous dispense test
Stable dispense volume
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | 0％ |
| Powder particle size（μm） | 45～25(Type 3) 38～20(Type 4) |
| Flux contents（％） | 14.5% |
| Deterioration（Pa・S） | 130 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | 3700 |
