Solder paste (bottle)
Printing type for LASER 8229 series
Suitable for LASER soldering
Suitable for LASER heat soldering.Achieve good soldering quality, despite the rapid heating.
Reduce solder ball
●Solder ball test by LASER heating
Few solder ball occurs by rapid heating in short time
Irradiation time:0.2 sec
Parts:1005R chip
Irrdiation method:Radiate the entire chip and pad
Printability
Enable to adopt into general use printer for SMT.No special printer is required
Stable viscosity
●Viscosity test of cotinuous printing
Stable viscosity of continuous printing
Brand-new process
Enable to adopt brand-new process combined LASER and printer which can shorten the SMT processing time as reflow oven is not required.
Suitable for LASER heating of SMT package
●LASER SMT test of QFP parts
Enables combine to printing, suitable for various SMT parts
Irradiation:5 sec/25pins
Parts:0.5mm pich QFP
Irradiation method:Scan irradiation to leads and pads
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | MIL-RMA |
| Halide contents | 0.10％～0.14％ |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 10.5% |
| Deterioration（Pa・S） | 230 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 8229 |
