Flux cored solder wire
Residue crack preventing type DDL series
Prevent residue crack
The flexible residues prevent cracking due to thermal shock and vibration. Omitting the step of applying coating material leads cost reduction.
Prevent residue cracking
No need coating material
●Thermal shock test
High reliability, no crack, no peeling
after 1000 heat cycle test.
【Condition】 -30℃～110℃ 30min 1000cycles
Joint develpment with DENSO
Full cooperation with Autmotive electrical equipment specialists in specification development and product evaluation.Coexistance at a high level about reliability and workability.
●Wettability test by using soldering robot.
Also capable for high difficulty components such as deep through-hole.
Iron mode:Line soldering
Capable in various soldering methods
Hand soldering, Iron robot, LASER, etc., Can use in various soldering methods.We can support wide range of diversified components.
Capable for Beam Heating
●Wettability test for connector by using light beam
Capable for rapid heating by light, stable wettability.
Cu Pad,One side
|Alloy type||J3 (Sn:Bal / Ag 3.0 / Cu 0.5)|
|Flux contents (%)||3.0％、4.0％|
|Copper plate corrosion test||No corrosion|
|Copper mirror corrosion||No corrosion|
|Insulation resistance（Ω）||More than 1.0×109Ω|
|Electrochemical migration||No migration|