Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (bottle)

Low melting point halogen free standard compliant type 7610 series
Applied with low melting point alloy

Special designed for SMT of heat-sensitive parts.Solution for non-heat resistant parts soldering.

Good wettability

●Good wettability at low temperature heating

Condition:Atmospheric
Component:1005 chip
Profile:See the right graph

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of 7610 series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Non compliant

Comply to major halogen-free standards

Applicable for low temperature reflow

Good wettability at even 160℃.Prevents joint failure and enhances reliability.

Compliant for low temperature reflow

●Reflow profile example

Sufficient wettability at a peak temperature of 160℃

Alloy type F7 (Sn:Bal / Bi 58)
Flux type Halogen free
Halide contents Less than 0.01%
Powder particle size(μm) 45~25(Type 3)
Flux contents(%) 9.5%
Deterioration(Pa・S) 200
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 1.0×108Ω
Electrochemical migration No migration
Halogen contents(ppm) Cl : Less than 50
Br : Less than 100
Flux name 7610

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