Solder paste (bottle)
Low melting point halogen free standard compliant type 7610 series
Applied with low melting point alloy
Special designed for SMT of heat-sensitive parts.Solution for non-heat resistant parts soldering.
Good wettability
●Good wettability at low temperature heating
Condition:Atmospheric
Component:1005 chip
Profile:See the right graph
Halogen-free compliant
No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.
Halogen-free compliant
●Compliant situation of 7610 series
Standards | Compliant situation |
---|---|
JPCA-ES01 | Compliant |
IEC61249-2-21 | Compliant |
IPC4101B | Compliant |
JEITA ET-7304A | Non compliant |
Comply to major halogen-free standards
Applicable for low temperature reflow
Good wettability at even 160℃.Prevents joint failure and enhances reliability.
Compliant for low temperature reflow
●Reflow profile example
Sufficient wettability at a peak temperature of 160℃
Alloy type | F7 (Sn:Bal / Bi 58) |
---|---|
Flux type | Halogen free |
Halide contents | Less than 0.01% |
Powder particle size(μm) | 45~25(Type 3) |
Flux contents(%) | 9.5% |
Deterioration(Pa・S) | 200 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | More than 1.0×108Ω |
Electrochemical migration | No migration |
Halogen contents(ppm) | Cl : Less than 50 Br : Less than 100 |
Flux name | 7610 |