Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (syringe)

Solder paste (syringe) List
Flux name Alloy type Flux type Halide contents Characteristics
3229 J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
MIL-RMA 0.08%~0.1% For SMT・connecter
3230 J3 (Sn:Bal / Ag 3.0 / Cu 0.5) MIL-RMA 0.08%~0.1% For micro components
3232 J3 (Sn:Bal / Ag 3.0 / Cu 0.5) Halogen free 0.10%~0.14% Halgen free for micro components
3700 J3 (Sn:Bal / Ag 3.0 / Cu 0.5) Halogen free 0% Completely halogen free type
2300 F12 (Sn:Bal / Bi 57.0 / Ag 1.0) Halogen free 0.16%~0.24% Halogen free low melting point

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