Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (bottle)

Easy wash type 8820 series
Good wettability

Special activators achieve the same wettability as regular non-crean solder paste.

Good wettability

●Confirm wettability during continuous printing

Good wettability continues even during long-term continuous printing
0.5mm QFP
Stencil thickness:0.15mm

Correspond to the washing process

Use material that is highly miscible with solvents for the flux base.Improves the washability of the residue.

Good washability

●Ionic residue test

After 1 min washing with IPA at 40℃, measure the amount of ions
Good washability in the ionic residue test

Long lasting printing stability

Prevents the reaction of the flux and powder, in order to prevent the viscosity increasement during continuous printing.Enable to implement stably.

Good stability on continuous printing

●Confimation of the shape of the printed solder paste

Stable shape after long time printing
0.5mm QFP
Stencil thickness:0.15mm

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type MIL-RMA
Halide contents Less than 0.007%
Powder particle size(μm) 38~25(Equivalent to type4)
Flux contents(%) 11.0%
Deterioration(Pa・S) 220
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Flux name 8820

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