Solder paste (syringe)
Halogen free for micro components 3232 series
Reduce solder ball
Special activator enables rapid heating SMT by LASER. Solution of solder ball by reducing slumps in heat.
Reduce solder ball
●Comparison of solder ball
No solder ball by rapid heating
1608R chip
Beam power:40W
Halogen-free compliant
No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.
Halogen-free compliant
●Comopliant situation of 3232 series
![](https://system.web-thorugh.jp/ishikawa_metal/uploads/evasol/101/""_m.)
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non compliant |
Comply to major halogen-free standards
Specialize in the micro-parts soldering
Special designed for the soldering of micro-components,Solution for peculiar problems of micro-components.
Suitable for LASER heating of narrow pitch
●SMT test of QFP parts
Suitable for various SMT parts
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | 0.10%～0.14% |
| Powder particle size（μm） | 25～15(Type 5) |
| Flux contents（％） | 14.5% |
| Deterioration（Pa・S） | 100 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | 1.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | 3232 |
