Solder paste (bottle)
High reliability type for automotive 1500 series
Prevent crack of residue
Elasticity of flux residue of applying special resin prevents crack of residue after soldering and helps to improve surface insulation resistance greatly
Prevent residue crack
●Thermal shock test(QFP shoot in transmitted light)
【Conditions】
-40℃ to 80℃ 30min 168 Cycles,
0.5mm pitch QFP
Good wettability
Select suitable activators for synthetic resin and the wettability is almost same as conventional solder paste
Good wettability
●Test by reflow soldering
Atmospheric:N2
Pre heat:150~200℃ 120 seconds
Main heat:240~245℃, 45 seconds
High electric reliability
Select suitable base resin and activators in order to get high surface insulation resistance.
High electric reliability
●Surface insulation resistance test
Achieve a high insulation resistance value than regular products
【Conditions】
Test board:JIS-II
Voltage:100V
Temp:85C
Humidity:85%
Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
---|---|
Flux type | JIS-AA |
Halide contents | Less than 0.02% |
Powder particle size(μm) | 38~20(Type 4) |
Flux contents(%) | 12.0% |
Deterioration(Pa・S) | 210 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | More than 1.0×109Ω |
Electrochemical migration | No migration |
Flux name | 1500 |