Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD


Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159


Flux cored solder wire

Water soluble type WSG series
Good wettability

Apply flux activator according to base material.Good solderbility can achieve higher productivity for various type parts.

Good wettability

●Wettability comparison in line soldering

Sustained wettability

  • 【Condition】

  • Iron temp:360℃

    Iron speed:5mm/s

Good water washability

Water soluble base material instead of rosin.The residue after soldering is possible to clean away easily with water.

Good water washability

●Ionic residue test

The flux residue is possible to clean with water

  • 【Test method】JIS Z 3197 8.5.2

    Cleaning solution:Pure water
    Washing temp:50℃
    Washing time:1 min
    Number of washings:3

Reduce spattering

With the effect of special activator, solder and flux spattering were reduced.Higher mounting quality can be secured.

Very few spattering

●Flux spattering test with soldering iron robot

Few spattering

  • Collect spattered flux onto thermal paper.

    Iron temp:380℃
    Feed speed:15mm/s
    Feed length:5mm × 200 shots

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
J9 (Sn:Bal / Ag 3.5 / Cu 0.7)
Flux type Water soluble type
Flux contents (%) 2.0%、3.0%
Halide contents 1.6%~2.4%
Copper plate corrosion test No corrosion
(after cleaning with water)
Copper mirror corrosion No corrosion
(after cleaning with water)
Insulation resistance(Ω) More than 1.0×108Ω
(after cleaning with water)
Electrochemical migration No migration
(after cleaning with water)
Flux name WSG

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