Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (bottle)

Less void halogen free standard compliant type 7510 series
Reduce void

Adding material which faciliated that the gas in the molten solder comes out, it may reduce the remaining of voids.

Reduce voids

●Comparison of voids after continuous printing

Stable void reduction

Halogen-free compliant

No intentional addition of chlorine(Cl) bromine(Br), which generate dioxins.Compliant with most of halogen-free standards

Halogen-free compliant

●Compliant situation of 7510 series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Non compliant

Comply to major halogen-free standards

Advanced wettability

Higher heat resistance can reduce defect of non-wetting and non-melting

Good wettability

●Confirmation of wettability by reflow

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type Halogen free
Halide contents Less than 0.01%
Powder particle size(μm) 38~20(Type 4)
Flux contents(%) 11.5%
Deterioration(Pa・S) 180
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 1.0×108Ω
Electrochemical migration No migration
Halogen contents(ppm) Cl : Less than 50
Br : Less than 100
Flux name 7510

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