Solder paste (bottle)
Less void halogen free standard compliant type 7510 series
Reduce void
Adding material which faciliated that the gas in the molten solder comes out, it may reduce the remaining of voids.
Reduce voids
●Comparison of voids after continuous printing
Stable void reduction
Halogen-free compliant
No intentional addition of chlorine(Cl) bromine(Br), which generate dioxins.Compliant with most of halogen-free standards
Halogen-free compliant
●Compliant situation of 7510 series
![](https://system.web-thorugh.jp/ishikawa_metal/uploads/evasol/69/""_m.)
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non compliant |
Comply to major halogen-free standards
Advanced wettability
Higher heat resistance can reduce defect of non-wetting and non-melting
Good wettability
●Confirmation of wettability by reflow
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | Less than 0.01％ |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 11.5% |
| Deterioration（Pa・S） | 180 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | 7510 |
