Solder paste (bottle)
Halogen free wash type 8825 series
Correspond to the washing process
Use a material that is highly miscible with solvents for the flux base.Improves the washability of the residue.
Good washability
●Ionic residue test
After 1 min washing with IPA at 40℃, measure the amount oof ions.
Good washability in the ionic residue test
Halogen-free compliant
No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.
Halogen-free compliant
●Compliant situation of 8825 series
![](https://system.web-thorugh.jp/ishikawa_metal/uploads/evasol/86/""_m.)
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non compliant |
Comply to major halogen-free standards
Long lasting printing stability
Prevents the reaction of the flux and powder,in order to prevent the viscosity increasement during continuous printing.Enable to implement stability.
Good stability on continuous printing
●Confirmation of the shape of the printed solder paste
Stable shape after long time printing
0.5mm QFP
Stencil thickness:0.15mm
| Alloy type | J3 (Sn:bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | Less than 0.01% |
| Powder particle size（μm） | 38～25(Equivalent to type 4) |
| Flux contents（％） | 11.0% |
| Deterioration（Pa・S） | 190 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 900 Br : Less than 900 |
| Flux name | 8825 |
