Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (bottle)

Halogen free wash type 8825 series
Correspond to the washing process

Use a material that is highly miscible with solvents for the flux base.Improves the washability of the residue.

Good washability

●Ionic residue test

After 1 min washing with IPA at 40℃, measure the amount oof ions.
Good washability in the ionic residue test

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of 8825 series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Non compliant

Comply to major halogen-free standards

Long lasting printing stability

Prevents the reaction of the flux and powder,in order to prevent the viscosity increasement during continuous printing.Enable to implement stability.

Good stability on continuous printing

●Confirmation of the shape of the printed solder paste

Stable shape after long time printing
0.5mm QFP
Stencil thickness:0.15mm

Alloy type J3 (Sn:bal / Ag 3.0 / Cu 0.5)
Flux type Halogen free
Halide contents Less than 0.01%
Powder particle size(μm) 38~25(Equivalent to type 4)
Flux contents(%) 11.0%
Deterioration(Pa・S) 190
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Halogen contents(ppm) Cl : Less than 900
Br : Less than 900
Flux name 8825

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