Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD


Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:(Representative)072-268-1155
    (Product and Technical Inquiries)072-268-1156
  • FAX:072-268-1159

Soldering issues

Measures for Void (Solder paste)
Void issues

The void at the soldered part occurs that the gas remains inside which is generated in soldering. The voids of up to 25% in area of joints are allowed in the IPC-A-610, an industry standard, but voids reduction is required for parts such as power devices, in order to improve heat dissipation efficiency and bond reliability.

Causes of void

Causes of void are as below
① Air bubbles remaining in unwetted parts
② Decomposition gas of flux remaining in solder
③ Decomposition gas caught in unwetted parts

Measures of void

To prevent voids, necessary not to make unwetted parts on boards and parts. It is important to adequately manage so that deterioration such as oxidation and moisture absorption does not occur during storage.
We have a less void type solder paste using materials with good wettability and less gas generation, so please contact us.

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