Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159
  • info@ishikawa-metal.com

無鉛(エバソル)

Solder paste (syringe)

For SMT・connecter 3229 series
Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
1608 chip
LASER power:8W

Suitable for large component

Enables SMT of complicated PCB for various parts large and small from the chip to the connector.

Suitable for large component

●Comparison of solder ball of connector parts

  • Prevention of solder ball for large component
    2.5mm pitch connector
    Beam power:40W

Already approved in automotive field

Approved by SMT of automotive electrical components more than 10 years.Suitable for higher requirement about SMT quality and reliability.

Reducing slumps in rapid heating

●Confirmation the shape with LASER heating

No slumps in heat, Preventing"Bridge"for large component.
2.5mm pitch connector
Beam power:40W

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type MIL-RMA
Halide contents 0.08%~0.1%
Powder particle size(μm) 45~25(Type 3)
38~20(Type 4)
Flux contents(%) 14.0%
Deterioration(Pa・S) 130
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Flux name 3229

Page top Contact us