Solder paste (syringe)
For SMT・connecter 3229 series
Reduce solder ball
Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.
Reduce solder ball
●Comparison of solder ball
No solder ball by rapid heating
1608 chip
LASER power:8W
Suitable for large component
Enables SMT of complicated PCB for various parts large and small from the chip to the connector.
Suitable for large component
●Comparison of solder ball of connector parts
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Prevention of solder ball for large component
2.5mm pitch connector
Beam power:40W
Already approved in automotive field
Approved by SMT of automotive electrical components more than 10 years.Suitable for higher requirement about SMT quality and reliability.
Reducing slumps in rapid heating
●Confirmation the shape with LASER heating
No slumps in heat, Preventing"Bridge"for large component.
2.5mm pitch connector
Beam power:40W
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | MIL-RMA |
| Halide contents | 0.08％～0.1％ |
| Powder particle size（μm） | 45～25(Type 3) 38～20(Type 4) |
| Flux contents（％） | 14.0% |
| Deterioration（Pa・S） | 130 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 3229 |
