Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD


Management System
ISO 9001:2015
ISO 14001:2015

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:072-268-1155 FAX:072-268-1159


Solder paste (syringe)

For SMT・connecter 3229 series
Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
1608 chip
LASER power:8W

Suitable for large component

Enables SMT of complicated PCB for various parts large and small from the chip to the connector.

Suitable for large component

●Comparison of solder ball of connector parts

  • Prevention of solder ball for large component
    2.5mm pitch connector
    Beam power:40W

Already approved in automotive field

Approved by SMT of automotive electrical components more than 10 years.Suitable for higher requirement about SMT quality and reliability.

Reducing slumps in rapid heating

●Confirmation the shape with LASER heating

No slumps in heat, Preventing"Bridge"for large component.
2.5mm pitch connector
Beam power:40W

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type MIL-RMA
Halide contents 0.08%~0.1%
Powder particle size(μm) 45~25(Type 3)
38~20(Type 4)
Flux contents(%) 14.0%
Deterioration(Pa・S) 130
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Flux name 3229

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