Solder paste (syringe)
Dispensing type for LASER BH63J3229G
For dispensing,LASER
Equivalent to JIS-AA,MIL-RMA
Special activator enables rapid heating SMT by LASER
Solution of solder ball by reducing slumps in heat.
Reduce solder ball
●Comparison of solder ball by optical beam
No solder ball by rapid heating
1608R Chip
Beam power:30W
| Alloy type | Sn63-Pb |
|---|---|
| Flux type | JIS-AA、MIL-RMA |
| Halide contents（％） | 0.08% |
| Powder particle size（μm） | 45～25(Type3) |
| Flux contents（％） | 12.0% |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | more than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 3229 |
