Solder paste (bottle)
Prevent "Tombstone" phenomenon BT02B878C
Addition of Ag to eutectic alloy widen the melting point
which may prevent "Tombstone" phenomenon.
Enhance adhesive charactoristic of flux may prevent micro component moving after mounting.
Also addition of Ag can prevent Ag corrosion and can get more strong soldering joint.
| Alloy type | Sn62-Pb36-Ag2 |
|---|---|
| Flux type | MIL-RMA |
| Halide contents（％） | 0.04％ |
| Powder particle size（μm） | 45~25(Type3) |
| Flux contents（％） | 9.5％ |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | more than 5.0×108Ω |
| Electrochemical migration | No Migration |
| Flux name | 878 |
