Solder paste (bottle)
Standard solder paste BH63B878C
Non clean type solder paste with conventional reflow.
Due to slightly higher contents of rosin, this is not suitable
with ICT test method.
| Alloy type | Sn63-Pb37 |
|---|---|
| Flux type | MIL-RMA |
| Halide contents（％） | 0.04％ |
| Powder particle size（μm） | 45~25(Type3) |
| Flux contents（％） | 9.5％ |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | more than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 878 |
