Solder paste (bottle)
High melting point solder paste B280J8882A、B280J8882C
Solder paste using high melting point alloy.
Suitable for components which has high temperature
such as power semiconductor.
Applying high viscosity flux may prevent solder balls
during reflow process.
| Alloy type | Sn5-Pb92.5-Ag2.5 |
|---|---|
| Flux type | RMA |
| Halide contents（％） | 0.10±0.04％ |
| Powder particle size（μm） | 45~25µm |
| Flux contents（％） | 8.0±0.5、9.5±0.5％ |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | more than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 8882 |
