Solder paste (syringe)
High melting point solder paste B280P3202J
Solder paste using high melting point alloy.
Suitable for components which has high temperature
such as power semiconductor.
Adjust flux viscosity to achieve stable dispensing by syringe.
| Alloy type | Sn5-Pb92.5-Ag2.5 |
|---|---|
| Flux type | Halogen free |
| Halide contents（％） | 0％ |
| Powder particle size（μm） | 45~25(Type3) |
| Flux contents（％） | 13.0±0.5％ |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | more than 5×108Ω |
| Electrochemical migration | No migration |
| Flux name | 3202 |
