Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

Certified office:Head office factory

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:(Representative)072-268-1155
    (Product and Technical Inquiries)072-268-1156
  • FAX:072-268-1159
  • info@ishikawa-metal.com

lead-containing

Solder paste (syringe)

Enhanced joint strength by LASER soldering BH63G3228G-HR

Applying special alloy which has high strength.
Suitable for the component which need high reliability
such as automotive components.
Rapid heating by LASER is available by applying special activator and reduce solder balls during soldering.

Alloy type Sn63-Pb
Flux type MIL-RMA
Halide contents(%) 0.04±0.02%
Powder particle size(μm) 53~38
Flux contents(%) 11.5±0.5%
Copper plate corrosion No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) more than 5.0×108Ω
Electrochemical migration No migration
Flux name 3228

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