Solder paste (syringe)
Residue flow prevent type solder paste BH63E3021F
Applying high viscosity flux for LASER soldering.
Achieve good appearance after soldering.
| Alloy type | Sn63-Pb |
|---|---|
| Flux type | MIL-RMA |
| Halide contents（％） | 0.04±0.01％ |
| Powder particle size（μm） | 53~38 |
| Flux contents（％） | 11.0±0.5％ |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | more than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 3021 |
