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WATER-SOLUBLE FLUX
WATER-SOLUBLE FLUX
Water-soluble flux products that help make soldering more efficient and reliable.
| Item name | Halide contents(％) | Cleaning after soldering | Features |
|---|---|---|---|
| Flast A | 33.4 | Necessary | Applicable to materials difficult to solder. With broad soldering temperature range of 130 to 450℃. The spreading rate is 95％ for cupper, 95％ for brass,90% for nickel,88％ for stainless steel, and 90％ for steel. |
| Flast S | 0.0 | Necessary | Especially for stainless steel,but applicable to copper,nickel and steel as well. Capable of soldering at relatively low temperature(about 250℃). Dissolves above 350℃,making soldering impossible. Umit soldering temperature to below 300℃. The spreading rate is 92％ for copper,92％ for brass,90％ for nickel,90% for stainless steel, and 91％ for steel. |
| Flast D | 0.36 | Unnecessary | For terminating copper wire;non-corrosive. To terminate wires,apply flux,then dip the wires in a 350～450℃ solder bath. The spreading rate is 92％ for copper |
| Flast DA | 0.18 | Unnecessary | Even more reliable product than D.Non-corrosive and for terminaling wires. The spreading rate is 90％ for copper. |
| Flast H | 32.0 | Necessary | Capable of high-strength soldering of stainless steel,zinc alloys,steel,nickel,brass,copper and other metal. Applicable to stained glass as well if diluted with water.The spreadingrate is 96％ for copper. |
| Flast I | 0.9 | Unnecessary | For terminaling leads.Decomposed at soldering temperature but is non-corrosive.The spreading rate is 94％ for copper. |
| Flast G | 1.3 | Necessary | Have high viscosity and can apply by brush. Applicable to nickel,copper,iron and other metals. The spreading rate is 90％ for copper. |
| Flast IH2 | 0.78 | Unnecessary | For electric light bulb bases(brass) |
